◆ Vacc: 130kV Max (25-130kV, 5kV steps)
◆ 单一平台级加速能力高达130kV,以最小化EOC尺寸
◆ 微电子自由电子枪
◆ 光束直径:> 1.6nm
◆ 发射极和阳极之间的静电透镜设计使用于实现消隐非常低的像差和短距离电极中心的交叉图像
◆ 使用双重热控制器实现了超稳定的写入能力
Electron Emitter/ Acceleration voltage |
TFE(ZrO/W)/25~130kV |
---|---|
Min. beam diameter | 1.6nm |
Scan method | Vector scan(x,y)(Standard) Vector scan(r,θ), Raster scan,Spot scan(Optional) |
Advanced lithography functions(Optional) |
Field size modulation lithography,axial symmetry pattern lithography |
Field size | 30μm□,60μm□,120μm□,300μm□,600μm□, 1000μm□ |
Work piece size | 4,6,8inchΦ(work pieces of other sizes and other shapes can be mounted with our flexible contrivances) |
CAD software | Dedicated CAD(Standard),GDSⅡconversion(Optiional), DXF conversion(Optional) |
OS | Windows |
◆ TFE 50kV
◆ 高分辨率与100kV相同
◆ 通过专门设计的激光干涉仪长时间进行高精度针迹写作
◆ 多用户环境(PC控制EOC =配方)
◆ 自我控制 - 隔绝噪音及热影响
◆ 灵活的书写方法(向量,向量R-θ,光栅,斑点,轴对称,场尺寸调制, 多重模式,3D结构
User's Voice : City University of Hong Kong
Electron Emitter/ Acceleration voltage |
TFE(ZrO/W)/5~50kV |
---|---|
Min. beam diameter | 2.0nm (for Academic and R&D) 3.0nm (for Production) |
Scan method | Vector scan(x,y)(Standard) Vector scan(r,θ), Raster scan,Spot scan (Optional) |
Advanced lithography functions(Optional) |
Field size modulation lithography,axial symmetry pattern lithography |
Field size | 30μm□ - 1000μm□(50kV) (for Academic and R&D) 30μm□ - 1500μm□(50kV) (for Production) |
Work piece size | 4,6,8inchΦ |
CAD software | Dedicated CAD(Standard),GDSⅡconversion (Optional), DXF conversion(Optional) |
OS | Windows |